Electronics Cooling

We design and manufacture the best performing and most cost effective cold plates for liquid cooling available today. Our innovative cold plates use our patented Micro Deformation Technology (MDT) inside and typically feature friction stir welded (FSW) construction however other joining methods such as vacuum brazing are available.  We offer two lines of standard cold plates as well as semi custom and custom cold plate options.

Our cold plates are perfect for: high power electronics, inverters, DC-DC converters, wind inverters, solar inverters, automotive, hybrid and electric vehicles, waste heat recovery, thermal electric (TEC), MRI amplifiers, power supplies, variable speed drives, locomotive, traction drives, agriculture machinery, lasers, RF amplifiers, data center, CPU, GPU, and chillers.

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Micro Deformation Technology (MDT)
Friction Stir Welding (FSW)
Manufacturing Technologies

High-power modules require excellent thermal performance and dependability, therefore adequate cooling is critical for reliable operation. We offer excellent thermal dissipation for high power electronic components by offering a series of high performance base plates.

IGBT base plates
Standard and Custom base plates
CLAD base plates

Semi-conductor chips or isolating substrates can be soldered directly to the MDT base plate eliminating the thermal interface layer (TIM), the largest thermal barrier in a power electronic package.

Wieland Microcool brings decades of experience both engineering and manufacturing enhanced boiling surfaces. Our MDT™ technology fills the unique application of both pool boiling or flow boiling.

• 245fa Refrigerant
• 3003 and 1100 Aluminum
• Brazed Construction
• Micro-Channel Evaporator
• Multiport tube/Folded Fin Condensor

Able to cool a 100W processor case to 70C with an air Inlet temp of 20C with only a 10 CFM (1.5 m/s velocity) flow.

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